Thermally Conductive Gap Filling Materials are generally low modulus polymer attached to the substrate such as glass fiber. It applies to semiconductor devices such as top of QFP, BGA (usually the case, several different devices share a high degree of heat sinks), between PCB and motherboard, frame or the thermal plate. The material has the shape of a high degree of adaptability, and have different thermal conductivity and thickness to choose from.
Commonly used in communications equipment, computers and peripherals, power conversion devices, memory modules, chip scale package and areas where heat needs to be transferred to a frame, chassis or other of heat spreader occasions.
Provide sheet form and custom die-cutting.
